Skip to main content
TR EN

EE SEMINAR:Digital Twins for 6G Networks: Architecture, Use Cases...

Guest: Dr.Çağlar Tunç

TitleDigital Twins for 6G Networks: Architecture, Use Cases and Challenges

Date: January 302024@13:40pm

Location FENS 2019 (physical only)

Abstract: Cellular networks are continuously evolving, and the change is  accelerated by the roll out of the fifth-generation (5G) and initial  development of the upcoming sixth-generation (6G). This necessitates the  use of computer-aided tools such as Digital Twins to efficiently design,  manage, and optimize networks. In this talk, we discuss a novel approach of  leveraging artificial intelligence (AI) to enhance the use of Digital Twins for  planning, managing and optimizing 6G networks. We show how AI can  enhance planning and optimization tools embedded in Digital Twins, like ray  tracing and network simulation tools. Then, we elaborate on applications of  Digital Twins and provide practical insights into some representative use  cases, including network planning, layer management, O-RAN control, and  application-aware network design. Finally, we discuss the Digital Twin design  objectives, challenges and open problems in the communications domain. 

Bio: Caglar Tunc received the B.S. and the M.S. degree in Electrical  and Electronics Engineering from Bilkent University, Ankara, Turkey, in 2013 and 2016, respectively, and the Ph.D. degree in Electrical and Computer  Engineering from New York University Tandon School of Engineering,  Brooklyn, NY, in 2022. He is currently a Senior Inventive Scientist at AT&T  Labs Research, Bedminster, NJ. Prior to joining AT&T, he worked as an  intern at Samsung Research America in 2020 and Futurewei Technologies in  the summers of 2017, 2018 and 2019. His research interests include  modeling wireless networks and access technologies, leveraging tools from  communication theory, stochastic processes, optimization, and machine  learning. He has over 20 published and working papers in journals and  conferences, and one U.S. Patent.